MOSFET Wafer
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| Type number | Gross Die | Wafer Size | Die Size(μm) | Product | VDSS (V) | ID (A) | Configuration | ESD | VGSth (V)max | VGSS (V) | Rdson(mΩ) @VGS10V Typ | Rdson(mΩ) @VGS4.5V Typ | Wafer Thickness | Back Metal | Datasheet |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HNM05A2500V | 8 inch | 6000×3750 | N | 2500 | 0.5 | 4.5 | 200000 | 400μm | Ti/Ni/Ag |  |
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| HSMD4R3N150 | 850 | 8 inch | 6360x5060 | N | 150 | 4.0 | +20V | 3.6 | 8 (±0.8)mil | Ti/Ni/Ag | |
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| HSMDG059A | 4550 | 8 inch | 2090x3060 | N | 40 | 4.0 | +20V/-12V | 2.5 | 4 (±0.4)mil | Ti/Ni/Ag | |
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| HSM200R600 | 40000 | 8 inch | 850×842 | N | 600 | 3.5 | 30 | 120 | 10mil | Ti/Ni/Ag | |
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| HSMDG09-03 | 24000 | 8 inch | 1260×960 | N | 30 | 2.5 | 20 | 6.6 | 9.2 | 4 (±0.4)mil | Ti/Ni/Ag | |
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| HSMDG22-40 | 3700 | 8 inch | 3600*1900 | N | 40 | 3.0 | 20 | 1.6 | 4mil（Taiko) | NiV/Ag | |
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| HM5R4V80C | 3460 | 8 inch | 3140*2560 | N | 80 | 3.4 | 20 | 5.4 | 200 | Ti/Ni/Ag | |
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| HNM50A500V | 150mm | 7000×10000 | N | 500 | 50 | 4.0 | 0.083 | 280 | |
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| HNM100A500V | 150mm | 14000×10000 | N | 500 | 100 | 4.0 | 40 | 280 | |
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| HNM18A200V | 150mm | 2850×4000 | N | 200 | 18 | 4.0 | 0.16 | 280 | |
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| HPM40A150V | 200mm | 3270×5220 | P | -150 | -40 | -3.0 | 70 | 175-200 | |
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| HNM500A100V | 200mm | 13408×9004 | N | 100 | 500 | 5.0 | 1 | 175 | |
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| HNM30A100V | 200mm | 2460×1860 | N | 100 | 30 | 2.5 | 20 | 175 | |
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| HNM5A1050V | 150mm | 5000×3600 | N | 1050 | 5 | 4.0 | 2.0 | 280 | |
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| HPM05A30V | 200mm | 970×670 | P | -30 | -4.5 | 1.4 | 50 | 65 | 175 | |
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| HNM80A100V | 200mm | 3158×2600 | N | 100 | 80 | 1.0 | 7.2 | 9.5 | 200 | |
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